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High Frequency Probing for Time and Frequency Domain

应用文章

Increasing consumer and business demand for cellular, wireless connectivity, digital entertainment, and information transmission is driving the need for high speed systems such as routers, servers, mobile phones and PCs. Technologies are evolving from first generation cellular to multimedia services and the current 4G telecommunication. In high-speed digital technologies, a similar trend is to push the data rates beyond Gbps. For example, SATA II 3 Gbps and USB 3.0 (4.8 Gbps) data rates are well beyond 1 Gbps.

As we push the data rates beyond gigabits per second, signal integrity is a major issue. Signal integrity raises two concerns in electrical design aspects:

– Timing - does the signal reach its destination when it supposed to?

– Signal quality - is the signal in good condition when it reaches its destination?

Under these conditions, high-speed analog effects, previously only seen in high frequency RF and microwave engineering, can impair the signal quality and degrade the bit error rate of the link. Testing the physical layer ensures that the devices, boards, and interconnects, have electrical characteristics that can support the high data rates without any significant signal degradation.

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