应用文章
Introduction
Feature miniaturization, especially in the electronics industry, demands knowledge of mechanical properties on the scale of nanometers. Instrumented indentation facilitates such testing, because the area of the contact impression does not have to be measured visually, but can be inferred solely from the relationship between applied force and consequential penetration of the indenter into the testing surface 1. Instrumented indentation has been used since the 1980’s to make measurements at the sub-micron scale, but recent developments allow quantitative determination of mechanical properties using indents of just a few nanometers deep. This article addresses special considerations for such testing, and reports results for seven different materials tested with the DCM II.
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