应用文章
Progress of semiconductor devices has rapidly accelerated toward high integration, high density and high functionality. In addition, use applications are widely penetrated into various consumer and industrial ields.
Failure analysis is the process of investigating semiconductor devices after failure is observed by electric measurement, and by physical, microscopy and chemical analysis techniques necessary to conirm the reported failure and clarify the failure mechanism. It relies on collecting failed components for subsequent examination of the cause or causes of failure using a wide array of methods. The NDT (nondestructive testing) methods are valuable because the failed products are unaffected by analysis, so inspection usually starts using these methods. “Microelectronics Failure Analysis Desk Reference” 5th edition published by ASM International is a good reference which covers the plethora of techniques employed in semiconductor failure analysis.
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