应用文章
Motivated by our desire to understand and improve the mechanical reliability of solder joints in integrated circuits, we used instrumented indentation to measure the Young’s modulus (E) and strain-rate sensitivity (m) of a common lead-free solder alloy, SAC 105 (98.5% Sn, 1% Ag, 0.5% Cu). Measured values (E = 49.1 ±1.6 GPa, m = 0.184 ±0.013) were remarkably close to what others have measured for unalloyed Sn by means of uniaxial tension and compression experiments, thus lending credibility to the indentation method.
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