Fast Track Chiplet Integration with Streamlined UCIe's Electrical Layer Analysis
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The massification of high-computational applications, such as Artificial Intelligence (AI), is steering the semiconductor industry from monolithic to chiplet-based design architectures. In this new design philosophy, various chip functions once housed within a single large die are now segregated into modular smaller dies, called chiplets, that can be combined in a larger system. As chiplets offer enhanced scalability, flexibility, and cost-effectiveness, they also present new challenges, particularly in die-to-die (D2D) communication. This presentation delves into the key attributes of electrical specification of the UCIe standard, and how to leverage EDA software to analyze the electrical layer efficiently.
In this webinar you will gain insights into the technical foundations of the UCIe standard, and learn how to modernize your design center using workflow-driven EDA tools that accelerate standard and advanced packaging D2D link analysis.
