Scratch Testing of Multilayered Metallic Film Stacks

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Scratch testing has commonly been used for characterizing the adhesion of single films to the substrate materials. Now, with the ability to survey the surface before and after the scratch test, the scratch process can be used to evaluate the type of failure occurring at different interfaces throughout multilayered film stacks.

Historically, the mechanical performances of multilayered thin-film metal stacks have been difficult to characterize for failure by any means. Recent developments in nanoscratch techniques, though, have made great headway in the examination of film failure of these multilayered film stacks. Scratch testing has commonly been used for characterizing the adhesion of single films to the substrate materials. Now, with the ability to survey the surface before and after the scratch test, the scratch process can be used to evaluate the type of failure occurring at different interfaces throughout multilayered film stacks. In this study, eight film stacks were tested to examine failure in individual layers of the samples. All of the samples had between three and four metal layers ranging in thickness from 100nm to 500nm. These samples were labeled as “Good” or “Bad” by the manufacturer.

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