Mechanical Characterization of Low-Dielectric-Constant Films
Publication Number: 5991-0694EN
Publication Date: 2014.08.02
Language: English
Application Notes

Mechanical Characterization of Low-Dielectric-Constant Films

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Mechanical characterization of low-k ilms deposited onsilicon is the single largest application for instrumented indentation. Thus, Keysight has continually sought test procedures and analyses which improve accuracy and minimize testing time for these kinds of samples.