Predicting RF Chip Reliability with Thermal Simulations
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Heat kills semiconductors and automotive environments are notorious for their extreme heat. Accurately predicting RF chip reliability is complicated and costly for design teams using only traditional methods of physical prototyping and measurements. An underperforming design can trigger board layout changes, selection of different chips, or limited operating specifications. Accurate EM and thermal simulations help RF component design teams shift from intense physical measurements to virtual space, shortening cycles and improving prototype success.