Sending massive data via 5G or 6G wireless links requires operating frequencies up to mmWave and sub-THz 250 GHz. The design of circuits and modules for handling high data throughput at these frequencies involves the tight integration of multiple technologies, e.g., Si, III-V, packaging, antennas, and PCB. This high data throughput needs new RF and Microwave design workflows, requiring the heterogeneous integration of multiple software tools to design these multi-technology products.
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