Videos

Analyzing Die-to-Die Interfaces In Multi-Die Designs

Analyzing Die-to-Die Interfaces In Multi-Die Designs
Show Description

Artificial Intelligence (AI) and Virtual Reality (VR) require fast, efficient, low-power technologies. Transistors are becoming harder and harder to shrink, so chiplets are a promising alternative. Chiplets are small, modular dies that use UCIe, an open industry standard, to communicate with each other. In this presentation, you will delve into the fundamentals of chiplet's high-speed standards, including UCIe communication from one Die-to-Die (D2D) PHY to another D2D PHY. Additionally, you'll explore how the simulation of eye diagrams, Bit Error Rate (BER), contours, and Voltage Transfer Function (VTF) can be easily computed and streamlined using an intelligent design environment.