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Explore dual-channel and ultra-wideband signal analysis for demanding RF workflows.
Get faster, clearer insights with our new multicore, 12-bit oscilloscope up to 33 GHz. Trade in your old oscilloscope and get credit toward a new XR8.
Bridging design and physical testing to evaluate drop, impact, shock, and vibration compliance before hardware exists.
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Strengthen 1.6T network reliability for AI-scale workloads from transceivers to interconnects.
Pair Keysight VSA software with the new XA5 signal analyzer for advanced visualization, demodulation, and analysis — start your 30-day trial today.
With extra memory and storage, these enhanced NPBs run Keysight's AI security and performance monitoring software and AI stack.
Explore end-to-end workflows spanning IC design, validation, wafer test, and photonics.
Explore curated support plans, prioritized to keep you innovating at speed.
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W8608EP Model Builder Program（MBP）UTSOI 模型生成元件是用于 Leti-UTSOI 的自动基带模型提取套件。此提取套件能够：
Leti-UTSOI 紧凑模型由 CEA-Leti 开发，主要用于描述 FDSOI 晶体管的电气特性，将其所有技术指标都考虑在内。该模型根据对器件的物理描述而建立，其所有参数都是物理参数，因而也能够用于工艺的预测性分析。模型中考虑到了薄膜硅前后界面之间的静电耦合，因此特别适合表示采用了低掺杂薄膜硅技术的器件的特性，包括绝缘层厚度从几纳米到几百微米的器件。
在其最新版本（2.x）中，Leti-UTSOI 紧凑模型加入了在硅膜背面建立反型层的完整描述。这个物理描述是通过求解晶体管静电方程式，根据其未经简化的原始结果而获得的。Leti-UTSOI 模型是第一个也是目前唯一具有此功能的紧凑模型，因此能够描述在晶体管前后界面上应用大范围极化时的晶体管特性。到 2019 年 4 月，UTSOI2 已进入 FDSOI 技术紧凑模型联盟（CMC）标准化过程的第二阶段。
返回 Model Builder Program（MBP）。
