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segmentation:business-unit/EISG,segmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:funnel/bofu,keysight:product-lines/1h,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/design-and-test-product/meter,keysight:dtx/solutions/facets/workflow-stage/functional-test,keysight:dtx/solutions/facets/industry/semiconductor,keysight:models/cx/cx3324asegmentation:business-unit/EISG,segmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:funnel/bofu,keysight:product-lines/1h,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/design-and-test-product/meter,keysight:dtx/solutions/facets/workflow-stage/functional-test,keysight:dtx/solutions/facets/industry/semiconductor,keysight:models/cx/cx3324asegmentation:business-unit/EISG,segmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:funnel/bofu,keysight:product-lines/1h,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/design-and-test-product/meter,keysight:dtx/solutions/facets/workflow-stage/functional-test,keysight:dtx/solutions/facets/industry/semiconductor,keysight:models/cx/cx3324asegmentation:business-unit/EISG,segmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:funnel/bofu,keysight:product-lines/1h,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/design-and-test-product/meter,keysight:dtx/solutions/facets/workflow-stage/functional-test,keysight:dtx/solutions/facets/industry/semiconductor,keysight:models/cx/cx3324asegmentation:business-unit/EISG,segmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:funnel/bofu,keysight:product-lines/1h,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/design-and-test-product/meter,keysight:dtx/solutions/facets/workflow-stage/functional-test,keysight:dtx/solutions/facets/industry/semiconductor,keysight:models/cx/cx3324asegmentation:business-unit/EISG,segmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:funnel/bofu,keysight:product-lines/1h,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/design-and-test-product/meter,keysight:dtx/solutions/facets/workflow-stage/functional-test,keysight:dtx/solutions/facets/industry/semiconductor,keysight:models/cx/cx3324asegmentation:business-unit/EISG,segmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:funnel/bofu,keysight:product-lines/1h,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/design-and-test-product/meter,keysight:dtx/solutions/facets/workflow-stage/functional-test,keysight:dtx/solutions/facets/industry/semiconductor,keysight:models/cx/cx3324asegmentation:business-unit/EISG,segmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:funnel/bofu,keysight:product-lines/1h,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/design-and-test-product/meter,keysight:dtx/solutions/facets/workflow-stage/functional-test,keysight:dtx/solutions/facets/industry/semiconductor,keysight:models/cx/cx3324asegmentation:business-unit/EISG,segmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:funnel/bofu,keysight:product-lines/1h,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/design-and-test-product/meter,keysight:dtx/solutions/facets/workflow-stage/functional-test,keysight:dtx/solutions/facets/industry/semiconductor,keysight:models/cx/cx3324asegmentation:business-unit/EISG,segmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:funnel/bofu,keysight:product-lines/1h,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/design-and-test-product/meter,keysight:dtx/solutions/facets/workflow-stage/functional-test,keysight:dtx/solutions/facets/industry/semiconductor,keysight:models/cx/cx3324asegmentation:business-unit/EISG,segmentation:campaign/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:funnel/bofu,keysight:product-lines/1h,keysight:dtx/solutions/facets/development-area/pow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如何使用数据记录仪模式进行长时间长度 测量
了解如何利用是德科技（Keysight）器件电流波形分析仪的数据记录仪模式，捕获并分析长时间的电流和电压波形。分析波形趋势，排查异常和拐点，并根据相似性对触发波形段进行分类，从而支持功耗优化、器件调试和可靠性验证。
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