Design of Transmon Qubit and CPW Resonator in Flip-Chip Technology with ADS, Quantum Pro
应用文章
Scaling up the number of superconducting qubits on a chip results in routing problems. To ease the routing and make the best use of the available chip area, going to the third dimension is a viable option. Among different methods, flip-chip technology is a promising 3D integration technique for many superconducting qubits.