Demos

3D Interconnect Designer for Advanced Packaging Workflows

3D Interconnect Designer for Advanced Packaging Workflows
Show Description

3D Interconnect Designer (standalone software version) provides a flexible modeling and optimization environment for any advanced interconnect structure, including chiplets, stacked die, packages, and PCBs. It supports heterogeneous integration and works with existing EDA environments.

 

Key capabilities

  • Modeling and optimization for vias, micro-bumps, transmission lines, and solder balls
  • Support for stacked die and 3DIC architectures
  • Hatched and waffle ground plane modeling
  • Custom bump map support
  • Works with ADS or external EDA workflows