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Pinpoint interference with post-processing spectrum management software in the lab.
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3D Interconnect Designer provides a flexible modeling and optimization environment for any advanced interconnect structure, including chiplets, stacked die, packages, and PCBs.
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可将测试时间从数小时缩短到几分钟。 可使用 N1081A 合规性测试与调试应用软件测量高速串行主机板、模块或 IC 的参数，包括两个 IEEE 802.3 标准要求的所有发射参数。
为了满足现有和新兴通信标准的测试需求，是德科技提供了广泛的电气和光通信测试解决方案。 在测试 IEEE 802.3 设计时，您可以选择适合的硬件组合，同时满足当前和未来的测试需求：
20 多种测试
FlexDCA 兼容版本：A.06.03.10
