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Pinpoint interference with post-processing spectrum management software in the lab.
Use this selector tool to quickly identify the best power supply for your aerospace and defense ATE requirements.
3D Interconnect Designer provides a flexible modeling and optimization environment for any advanced interconnect structure, including chiplets, stacked die, packages, and PCBs.
Get faster digital validation for less with a trade-in.
Emulate every part of your data center infrastructure. Emulate Anything. Optimize Everything.
With extra memory and storage, these enhanced NPBs run Keysight's AI security and performance monitoring software and AI stack.
Achieve fast, accurate board-level testing with robust inline and offline ICT designed for modern manufacturing.
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Authoritative application notes, data sheets, reference designs, and test procedures to accelerate design and validation decisions.
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HeatWave 是适用于芯片和堆叠裸片系统级封装（SiP）的 IC 电热仿真器。它能够以器件和互连的空间分辨率计算全芯片温度特征曲线，并将这一数据作为注释提供给电路仿真器，确保仿真结果具有极高的温度精度。由于电源的几何特性和芯片内部的热传导路径都处于亚微米级范围，所以热建模和数值求解方法必须适应这种特性尺寸。求解结果是三维温度特征曲线，包括必要的分辨率和精度。
HeatWave 电热分析软件包括两种配置；选择哪种配置取决于需要的分析类型（稳态与瞬态热分析）和设计建模的复杂性（器件数量，例如作为热源/电源建模的晶体管数量）。
W2590ET HeatWave 电热仿真软件包括可与第三方电路仿真软件配合使用的瞬态和稳态热求解程序，以及用于显示三维热结果的用户界面。大容量瞬态求解程序可执行温度与时间分析。
