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Explore dual-channel and ultra-wideband signal analysis for demanding RF workflows.
Get faster, clearer insights with our new multicore, 12-bit oscilloscope up to 33 GHz. Trade in your old oscilloscope and get credit toward a new XR8.
Bridging design and physical testing to evaluate drop, impact, shock, and vibration compliance before hardware exists.
Unlock your free upgrade to the next bandwidth tier.
Strengthen 1.6T network reliability for AI-scale workloads from transceivers to interconnects.
Pair Keysight VSA software with the new XA5 signal analyzer for advanced visualization, demodulation, and analysis — start your 30-day trial today.
With extra memory and storage, these enhanced NPBs run Keysight's AI security and performance monitoring software and AI stack.
Explore end-to-end workflows spanning IC design, validation, wafer test, and photonics.
Explore curated support plans, prioritized to keep you innovating at speed.
Maximize accuracy and performance with precision accessories engineered for Keysight instruments.
Authoritative application notes, data sheets, reference designs, and test procedures to accelerate design and validation decisions.
Hands‑on bootcamps that teach system design, test methods, and production workflows engineers can apply immediately.
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观看 ADS 电热仿真的 30 秒演示 ADS 电热仿真组件的功能包括：
支持的其他特性还包括：
在为功率放大器模块等产品设计大功率 RFIC/MMIC 元器件时，是否知道精确的器件温度决定了电路仿真的精度。现在的许多晶体管模型都包括自热模型，但它并没有考虑到器件之间的热耦合，也没有考虑到通过芯片和封装的热传递。这可能会带来巨大的不精确度，尤其是在有多个功率晶体管间距很小的高集成度设计中。ADS 电热分析解决方案通过将热耦合和封装热特性都考虑在内来确定器件温度，从而可以提供准确的“温度敏感型”IC 仿真结果。 这个十分适合 RFIC/MMIC 应用的全新热求解程序现已整合到 ADS 2012 中。该求解程序利用 ADS 电路仿真器给出的功耗数据、ADS 版图设计给出的器件位置信息以及工艺设计套件（PDK）给出的材料热特性，对 IC 进行完整的 3D 热分析。它与电路仿真器配合进行迭代运算，热求解程序向电路仿真器提供更新的温度数据，然后电路仿真向热求解程序提供更新的功耗值，如此往复直至得出收敛的解。在 ADS 数据显示界面中可以查看“温度敏感型”电路的仿真结果（例如增益、失真水平）。三维查看器可以显示 IC 的动态温度图。
