Deliver production-ready models faster with automated extraction.
Advanced semiconductor technologies demand greater model accuracy under increasingly aggressive development schedules. MBP combines automated extraction flows, machine-learning-assisted optimization, and flexible customization capabilities to streamline model generation from measured data to final model libraries.
Supporting industry-standard compact models and advanced technologies, MBP helps modeling teams reduce extraction effort, improve consistency, and accelerate model creation without compromising accuracy.
Reduce model extraction time with machine learning optimization.
Create production-ready compact models with minimal effort.
Advanced SPICE Integration
Adapt flows using Python and MBP scripting.
Generate binning, mismatch, and variability models.
Support leading compact models for advanced technologies.
MBP Configuration Guide provides a detailed overview of the MBP software suite, designed to support semiconductor device modeling engineers in extracting model parameters, running SPICE simulations, and generating model libraries.
EDA software bundles provide designers with pre-configured combinations targeted to a specific design workflow.
Device Modeling MBP automates compact model extraction, parameter optimization, and model library generation for semiconductor devices used in analog, RF, logic, and mixed-signal circuit design.
MBP supports industry-standard compact models including BSIM-BULK, BSIM-CMG, and BSIM-IMG, enabling modeling of advanced semiconductor technologies and device architectures.
MBP leverages AI-driven optimization techniques that can significantly reduce extraction time while simultaneously handling complex parameter sets and multiple measurement targets.
Yes. MBP includes Python support and scripting capabilities that allow engineers to customize extraction procedures, automate repetitive tasks, and create application-specific workflows.
MBP provides turnkey solutions for statistical model extraction, mismatch analysis, model binning, SRAM modeling, HVMOS modeling, and other advanced semiconductor modeling requirements.
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