Power Integrity EM Professional (PIPro)

Ensure stable power delivery from DC to GHz for optimal system performance.

Power Integrity EM Professional (PIPro) on laptop

Why Use Power Integrity EM Professional (PIPro)

Build confidence in power delivery network performance.

PIPro empowers engineers to design reliable end-to-end power delivery networks (PDN) with unmatched speed, accuracy, and insight. Leveraging advanced electromagnetic, circuit, and thermal simulation technologies, PIPro helps engineers identify IR drop, resonance, current density plots, dynamic sync behaviors, power distribution bottlenecks, and EMI performance early in the design cycle. Its scalable architecture delivers the performance needed to analyze large, complex designs while maintaining the fidelity required for confident design decisions. PIPro provides a comprehensive view of power delivery behavior, enabling engineers to accelerate design closure, reduce costly redesigns, and ensure robust system operation before hardware is built.

Resources to Get You Started

What’s New in Power Integrity EM Professional (PIPro)

Discover the latest release designed to help engineers work faster, simulate more accurately, and accelerate product development.

Explore Power Integrity EM Professional (PIPro) Bundles

EDA software bundles provide designers with pre-configured combinations targeted to a specific design workflow.

Image of  PathWave ADS 核心、电磁设计、版图、高速数字电路仿真、PIPro 软件套件
PathWave ADS 核心、电磁设计、版图、高速数字电路仿真、PIPro 软件套件
Model
W3623B

W3623B 是一款电源完整性分析软件套件,另外还提供了高速串行通道仿真功能。 PIPro 中的电磁分析功能能够比通用电磁分析工具更快完成分析。

Image of  PathWave ADS 核心、电磁设计、版图、高速数字电路仿真、SIPro、PIPro
PathWave ADS 核心、电磁设计、版图、高速数字电路仿真、SIPro、PIPro
Model
W3625B

包括对高速串行通道的版图后期电磁验证,以及信号完整性和电源完整性分析。

Image of  PathWave ADS 核心、电磁设计、版图、高速数字电路仿真、存储器、SIPro、PIPro
PathWave ADS 核心、电磁设计、版图、高速数字电路仿真、存储器、SIPro、PIPro
Model
W3626B

包括对高速数字串行通道的版图后期验证,以及内存、信号完整性和电源完整性分析。

Image of  PathWave ADS 核心、电磁设计、版图、高速数字电路仿真、SIPro、PIPro、FEM 软件套件
PathWave ADS 核心、电磁设计、版图、高速数字电路仿真、SIPro、PIPro、FEM 软件套件
Model
W3627B

W3627B 能够对高速串行总线进行版图前期验证,并可使用 FEM 仿真器对连接器等 3D 元器件进行更准确的电磁仿真。

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