了解更多
keysight:models/pz,keysight:product-lines/1h,segmentation:product-formfactor/Modular,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:funnel/tofu,segmentation:campaign/IC_Semi_Mfg,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/workflow-stage/functional-test,keysight:dtx/solutions/facets/industry/semiconductor,segmentation:product-category/IC_Semi_Mfg,segmentation:business-unit/EISG,keysight:dtx/solutions/facets/design-and-test-product/power-supplykeysight:models/pz,keysight:product-lines/1h,segmentation:product-formfactor/Modular,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:funnel/tofu,segmentation:campaign/IC_Semi_Mfg,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/workflow-stage/functional-test,keysight:dtx/solutions/facets/industry/semiconductor,segmentation:product-category/IC_Semi_Mfg,segmentation:business-unit/EISG,keysight:dtx/solutions/facets/design-and-test-product/power-supplykeysight:models/pz,keysight:product-lines/1h,segmentation:product-formfactor/Modular,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:funnel/tofu,segmentation:campaign/IC_Semi_Mfg,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/workflow-stage/functional-test,keysight:dtx/solutions/facets/industry/semiconductor,segmentation:product-category/IC_Semi_Mfg,segmentation:business-unit/EISG,keysight:dtx/solutions/facets/design-and-test-product/power-supplykeysight:models/pz,keysight:product-lines/1h,segmentation:product-formfactor/Modular,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:funnel/tofu,segmentation:campaign/IC_Semi_Mfg,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/workflow-stage/functional-test,keysight:dtx/solutions/facets/industry/semiconductor,segmentation:product-category/IC_Semi_Mfg,segmentation:business-unit/EISG,keysight:dtx/solutions/facets/design-and-test-product/power-supplykeysight:models/pz,keysight:product-lines/1h,segmentation:product-formfactor/Modular,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:funnel/tofu,segmentation:campaign/IC_Semi_Mfg,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/workflow-stage/functional-test,keysight:dtx/solutions/facets/industry/semiconductor,segmentation:product-category/IC_Semi_Mfg,segmentation:business-unit/EISG,keysight:dtx/solutions/facets/design-and-test-product/power-supplykeysight:models/pz,keysight:product-lines/1h,segmentation:product-formfactor/Modular,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:funnel/tofu,segmentation:campaign/IC_Semi_Mfg,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/workflow-stage/functional-test,keysight:dtx/solutions/facets/industry/semiconductor,segmentation:product-category/IC_Semi_Mfg,segmentation:business-unit/EISG,keysight:dtx/solutions/facets/design-and-test-product/power-supplykeysight:models/pz,keysight:product-lines/1h,segmentation:product-formfactor/Modular,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:funnel/tofu,segmentation:campaign/IC_Semi_Mfg,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/workflow-stage/functional-test,keysight:dtx/solutions/facets/industry/semiconductor,segmentation:product-category/IC_Semi_Mfg,segmentation:business-unit/EISG,keysight:dtx/solutions/facets/design-and-test-product/power-supplykeysight:models/pz,keysight:product-lines/1h,segmentation:product-formfactor/Modular,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:funnel/tofu,segmentation:campaign/IC_Semi_Mfg,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/workflow-stage/functional-test,keysight:dtx/solutions/facets/industry/semiconductor,segmentation:product-category/IC_Semi_Mfg,segmentation:business-unit/EISG,keysight:dtx/solutions/facets/design-and-test-product/power-supplykeysight:models/pz,keysight:product-lines/1h,segmentation:product-formfactor/Modular,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:funnel/tofu,segmentation:campaign/IC_Semi_Mfg,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/workflow-stage/functional-test,keysight:dtx/solutions/facets/industry/semiconductor,segmentation:product-category/IC_Semi_Mfg,segmentation:business-unit/EISG,keysight:dtx/solutions/facets/design-and-test-product/power-supplykeysight:models/pz,keysight:product-lines/1h,segmentation:product-formfactor/Modular,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:funnel/tofu,segmentation:campaign/IC_Semi_Mfg,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/workflow-stage/functional-test,keysight:dtx/solutions/facets/industry/semiconductor,segmentation:product-category/IC_Semi_Mfg,segmentation:business-unit/EISG,keysight:dtx/solutions/facets/design-and-test-product/power-supplykeysight:models/pz,keysight:product-lines/1h,segmentation:product-formfactor/Modular,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:funnel/tofu,segmentation:campaign/IC_Semi_Mfg,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/workflow-stage/functional-test,keysight:dtx/solutions/facets/industry/semiconductor,segmentation:product-category/IC_Semi_Mfg,segmentation:business-unit/EISG,keysight:dtx/solutions/facets/design-and-test-product/power-supplykeysight:models/pz,keysight:product-lines/1h,segmentation:product-formfactor/Modular,segmentation:product-category/IC_Semi_Mfg/Semiconductor_Test,segmentation:funnel/tofu,segmentation:campaign/IC_Semi_Mfg,keysight:dtx/solutions/facets/development-area/power,keysight:dtx/solutions/facets/workflow-stage/functional-test,keysight:dtx/solutions/facets/industry/semiconductor,segmentation:product-category/IC_Semi_Mfg,segmentation:business-unit/EISG,keysight:dtx/solutions/facets/design-and-test-product/power-supply
如何表征低功耗集成电路
测量低功耗集成电路的电流/电压特性需要多种基础仪器 多路电源、数字万用表 DMM)、脉冲发生器和数字化仪。了解如何通过单一源/测量单元(SMU)高效快速地表征低功耗集成电路。
了解更多