Electro-Thermal Dynamic Model Generator and Simulator

Most trusted RF and microwave design software in the industry.

Electro-Thermal Dynamic Model Generator on laptop

Why Use Electro-Thermal Dynamic Model Generator

Generates time-varying electro-thermal (ETH) models to significantly speed up subsequent electro-thermal simulations by typically 20x. 

The Electro-thermal Dynamic Model Generator computes and generates dynamic (transient) electrothermal (ETH) models for reuse by the ADS W3050E electrothermal simulator . It speeds up dynamic electroelectro-thermal simulation by 20x to as much as over 400x depending on the complexity of the input signal modulation and circuit simulator required to analyze the design. The significant speedup allows electrothermal simulation to be used in layout design exploration for the optimal thermal structure in mission critical designs. 

The Electro-thermal Dynamic Model Generator is integrated within ADS for closed-loop dynamic circuit-electrothermal cosimulation when used together with Circuit-Envelope or Transient-Convolution circuit simulators in ADS. The generated dynamic ETH model can also be used for steady-state electrothermal simulation with the linear or harmonic balance circuit simulators. The W3051E also supports dynamic electrothermal simulation across multi-technology (IC,-package-laminate-PCB) boundaries in 3D Heterogeneous Integration (3DHI) modules. 

Prerequisite: Requires Electro-Thermal Simulator (W3050E).

Why Use Electro-Thermal Simulator

Temperature-aware circuit simulation results based on high capacity state-of-the-art thermal solver technology directly integrated with the ADS layout environment and circuit simulators. Eliminates manual design transfer to standalone thermal solvers.

The Electro-Thermal simulator provides accurate, “temperature aware” IC simulation results by using device temperatures that take into account thermal coupling and thermal characteristics of the package. It runs full 3D thermal analysis of the IC, utilizing power dissipation data from ADS circuit simulator; device location from ADS layout; and material thermal properties from the process design kit (PDK).  3D visualization displays a dynamic temperature map of the IC to enable fixing hot spots before tape-out.

Electro-Thermal Simulator

Prerequisite: Requires ADS host bundle with nonlinear circuit simulation and layout capabilities to work. 

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