Generates time-varying electro-thermal (ETH) models to significantly speed up subsequent electro-thermal simulations by typically 20x.
The Electro-thermal Dynamic Model Generator computes and generates dynamic (transient) electrothermal (ETH) models for reuse by the ADS W3050E electrothermal simulator . It speeds up dynamic electroelectro-thermal simulation by 20x to as much as over 400x depending on the complexity of the input signal modulation and circuit simulator required to analyze the design. The significant speedup allows electrothermal simulation to be used in layout design exploration for the optimal thermal structure in mission critical designs.
The Electro-thermal Dynamic Model Generator is integrated within ADS for closed-loop dynamic circuit-electrothermal cosimulation when used together with Circuit-Envelope or Transient-Convolution circuit simulators in ADS. The generated dynamic ETH model can also be used for steady-state electrothermal simulation with the linear or harmonic balance circuit simulators. The W3051E also supports dynamic electrothermal simulation across multi-technology (IC,-package-laminate-PCB) boundaries in 3D Heterogeneous Integration (3DHI) modules.
Generation of dynamic electrothermal (ETH) models for reuse in Advanced Design System (ADS).
Speed up dynamic ETH modulated signal analysis with Circuit Envelope ETH simulation by typically 20x and up to 160x.
Speed up transient ETH simulation typically by 100x and up to over 400x.
Dynamic ETH models also work in steady-state mode with harmonic balance and linear circuit simulators.
Prerequisite: Requires Electro-Thermal Simulator (W3050E).
Temperature-aware circuit simulation results based on high capacity state-of-the-art thermal solver technology directly integrated with the ADS layout environment and circuit simulators. Eliminates manual design transfer to standalone thermal solvers.
The Electro-Thermal simulator provides accurate, “temperature aware” IC simulation results by using device temperatures that take into account thermal coupling and thermal characteristics of the package. It runs full 3D thermal analysis of the IC, utilizing power dissipation data from ADS circuit simulator; device location from ADS layout; and material thermal properties from the process design kit (PDK). 3D visualization displays a dynamic temperature map of the IC to enable fixing hot spots before tape-out.
Temperature aware circuit simulation with state-of-the-art thermal solver technology for high power RFIC/MMIC component designs.
Integrated with Advanced Design System (ADS) layout and circuit simulators to eliminate need for manual transfer of designs to external thermal solvers.
3D visualization of dynamic thermal map identifies potential hot spots to fix before tape out,
High capacity solver tests on SoC designs with thousands of components.
Prerequisite: Requires ADS host bundle with nonlinear circuit simulation and layout capabilities to work.
The Keysight Electro-Thermal Simulator (W3050E), Electro-Thermal Dynamic Model Generator (W3051E) and ADS Electro-Thermal HPC 1-pack (W3059E) is a suite of electro-thermal (ETH) simulation tools that integrates with the transient and steady-state circuit simulators in ADS to deliver the highest accuracy in circuit simulation.
It accounts for layout-dependent localized steady-state and time-varying electro-thermal heating of circuit components that alters device characteristics, degrades RF/Microwave circuit performance, and reduces reliability. It replaces guesswork assumption of fixed ambient temperature settings for circuit simulation.
Keysight Electro-Thermal (ETH) Simulation Suite integrates with Advanced Design System (ADS) to accurately model both steady-state and transient electro-thermal effects in RF and microwave circuits. By accounting for localized self-heating and temperature-dependent device behavior, it enables engineers to predict performance degradation, improve design reliability, and eliminate assumptions based on fixed ambient temperatures during simulation.
Modern RF and microwave circuits operate with pulsed and digitally modulated signals that generate time-varying heat. Traditional circuit simulation often overlooks these thermal effects, leading to inaccurate predictions. The ETH Simulation Suite captures localized heating and its impact on device characteristics, helping engineers avoid performance issues, design failures, and costly hardware redesigns.
Power amplifiers experience significant temperature changes when operating under pulsed and modulated signals. The ETH Simulation Suite accurately predicts temperature-driven variations in device performance, impedance, and linearity. Engineers can evaluate thermal impacts on critical metrics such as Error Vector Magnitude (EVM) and Adjacent Channel Power Ratio (ACPR), enabling more robust and reliable amplifier designs.
Yes. The ETH Simulation Suite models thermal interactions between closely packed devices within RF modules and integrated assemblies. It captures both localized and time-varying heating effects that can influence neighboring components, resulting in more accurate performance prediction. This capability helps engineers optimize packaging strategies and improve overall module reliability.
Unlike conventional circuit simulators that assume constant device temperatures, the ETH Simulation Suite performs coupled electro-thermal analysis using proven Keysight HeatWave technology. It visualizes transient temperature distributions, identifies hot spots, and predicts how thermal behavior affects RF performance over time, providing deeper insight into reliability, efficiency, and real-world circuit operation.
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