Why Use RF EM Professional (RFPro)
Automatic 3DEM-circuit co-simulation for RF circuit and module design.
RFPro enables RF/Microwave circuits designers using ADS, Virtuoso, or Custom Compiler to easily run 3DEM-circuit cosimulation without destructive layout cookie-cutting or schematic alterations, thereby preserving design integrity from start to finish. Any RF path or net containing passive and active components can be selected in place for automatic 3DEM-circuit cosimulation to integrate EM results effortlessly into circuit design for interactive tuning and optimization. It eliminate tedious and error prone manual stitching of EM ports to circuit nodes for analyzing EM effects on circuit performance. Mesh domain optimization (MDO) intelligently meshes any selected RF portion of your design amidst large ground or power planes for accurate EM analysis.. Includes both 3D planar Momentum and full 3D FEM simulators to efficiently analyze any EM structures. RFPro has automatic parameterization of electrical or physical parameters, such as dielectric constant, layer-to-layer registration, over/under etching and layer thickness, to analyze the effects of manufacturing tolerances on electrical specs.
Key Capabilities
Automatically combines electromagnetic and circuit analysis for accurate RF performance prediction.
Analyze and optimize RF layouts within an integrated interactive 3D design environment.
Use FEM, Momentum, and HFSS solvers from a single interface.
Eliminates manual layout isolation and automatically extracts simulation-ready structures.
Works with Keysight ADS, Cadence Virtuoso, Synopsys Design Compiler, and Mentor Tanner.
Preserves OpenAccess (OA) databases and tracks simulation data through design changes.
Resources to Get You Started
Keysight RFPro is an EM (electromagnetic) design environment for RF circuit designers. It automates EM circuit co-simulation to account for EM effects on RF circuit performance in 3D IC layouts, packaging, interconnects, transitions, and PCB boards.
Bootcamps
More Resources
电子书
Four Secrets to Mastering Millimeter-Wave Communications Circuit Design
eBooks
Optimize Your RF Board Design Flow
应用文章
Designing Robust 5G Power Amplifiers for the Real World
解决方案概述
Bringing Beamforming and mmWave to 5G UEs
解决方案概述
RF 3DHI Modules and RF Chiplet Designs Crucial to 6G RF Systems
Explore RFPro Bundles
EDA software bundles provide designers with pre-configured combinations targeted to a specific design workflow.
PathWave ADS 核心 + 电磁设计 + 版图 + RFPro
PathWave ADS 和电磁设计环境配有线性电路和 RFPro 3D 电磁仿真器（Momentum 和 FEM）。 射频版图和 3D 故障回避路由选择软件支持对多技术射频模块进行物理设计以及执行 DRC/LVS/LVL 模块级验证，实现准确无误的组装。
PathWave ADS 和电磁设计环境配有线性电路和 RFPro 3D 电磁仿真器（Momentum 和 FEM）。 射频版图和 3D 故障回避路由选择软件支持对多技术射频模块进行物理设计以及执行 DRC/LVS/LVL 模块级验证，实现准确无误的组装。
PathWave ADS 核心 + 电磁设计 + 版图 + RFPro + 射频电路仿真
W3606B PathWave ADS 和电磁设计环境配有 3D 射频版图，可用于设计射频模块，以及进行模块级 DRC/LVS/LVL 验证，确保准确无误的组装。
W3606B PathWave ADS 和电磁设计环境配有 3D 射频版图，可用于设计射频模块，以及进行模块级 DRC/LVS/LVL 验证，确保准确无误的组装。
PathWave ADS 核心 + 电磁设计 + 版图 + RFPro + 射频电路仿真 + 系统电路验证
W3607B PathWave ADS 和电磁设计环境配有 3D 射频版图，可用于设计射频模块，以及进行模块级 DRC/LVS/LVL 验证，确保准确无误的组装。
W3607B PathWave ADS 和电磁设计环境配有 3D 射频版图，可用于设计射频模块，以及进行模块级 DRC/LVS/LVL 验证，确保准确无误的组装。
PathWave ADS 核心 + 电磁设计 + 版图 + RFPro + 射频电路仿真 + 系统电路验证 + 完整的 VTB
PathWave ADS 和电磁设计环境配有 3D 射频版图，可用于设计采用了多种技术的射频模块，以及进行模块级 DRC/LVS/LVL 验证，确保准确无误的组装。
PathWave ADS 和电磁设计环境配有 3D 射频版图，可用于设计采用了多种技术的射频模块，以及进行模块级 DRC/LVS/LVL 验证，确保准确无误的组装。
PathWave ADS 核心 + 电磁设计 + RFIC 设计四路 + 版图 + RFPro + 射频电路仿真 + 系统电路验证 + VTB
W3609B PathWave ADS 和电磁设计环境配有 3D 射频版图，可用于设计采用了多种技术的射频模块，以及进行模块级 DRC/LVS/LVL 验证。
W3609B PathWave ADS 和电磁设计环境配有 3D 射频版图，可用于设计采用了多种技术的射频模块，以及进行模块级 DRC/LVS/LVL 验证。
ADS Core, EM Design Core, Layout, RFPro, HB
ADS and EM design environments with 3D RF layout for multi-technology RF module design and module level DRC/LVS/LVL verification for error-free assembly. Nonlinear Harmonic Balance circuit) and RFPro EM (Momentum and FEM) simulators.
ADS and EM design environments with 3D RF layout for multi-technology RF module design and module level DRC/LVS/LVL verification for error-free assembly. Nonlinear Harmonic Balance circuit) and RFPro EM (Momentum and FEM) simulators.
Have Questions? We've Got Answers
Keysight RFPro is an electromagnetic (EM) design environment that automates EM-circuit co-simulation for RF and microwave engineers. It enables designers to analyze how physical structures such as IC layouts, packages, interconnects, transitions, and PCBs affect circuit performance. By integrating EM analysis directly into the design workflow, RFPro simplifies tuning, optimization, and verification while improving simulation accuracy.
Keysight RFPro eliminates many manual steps traditionally required for EM simulation, including layout isolation, component extraction, and data translation. Automated setup, EM-circuit connectivity, and error-free data stitching allow engineers to focus on design optimization rather than simulation preparation. This streamlined workflow accelerates development cycles and helps teams reach design goals faster with greater confidence.
Keysight RFPro provides access to multiple EM simulation technologies from a common user interface, including full 3D Finite Element Method (FEM) and planar 3D Momentum solvers. Users can also launch HFSS analyses from the same environment. This flexibility allows designers to select the most appropriate solver for their specific application while maintaining a consistent workflow.
Yes. Keysight RFPro integrates with multiple industry-standard design platforms, including Keysight ADS, Cadence Virtuoso, Synopsys Design Compiler, and Mentor Tanner. It preserves OpenAccess (OA) database integrity without requiring file translations, helping maintain design traceability and reducing workflow complexity across heterogeneous design environments.
Keysight RFPro supports a wide range of RF and microwave applications, including RFICs, MMICs, RF modules, antenna systems, advanced packaging, and PCB designs. It is particularly valuable for complex multi-technology products such as 5G/6G wireless systems, phased-array antennas, millimeter-wave modules, and high-frequency packaging where electromagnetic effects strongly influence circuit performance.