HMMC-5633 5 GHz SMT Packaged GaAs Diode Limiter

Introduction

The HMMC-5633 is a packaged 5 GHz reverse power protection (RPP) and limiter GaAs ID. The device can be used to protect sensitive RF circuits from excess RF power, DC transients and ESD from DC to 5 GHz. The circuit contains Planar–Doped– Barrier (PDB) diodes with integrated matching networks consisting of spiral inductors and MIM capacitors. The device is fabricated with the Modified Barrier Integrated Diode (MBID) process. This process allows the barrier height of the diodes and the number of diodes in each “stack” Maximum continuous RF input power 4 Watts to be optimized for low harmonic distortion when Pin <20 dBm while limiting transmitted power to less than 1 watt when Pin = 10 watts.

Absolute Maximum Ratings 1

Applications

The HMMC-5633 was designed for Reverse power protection (RPP), limiter and ESD protection applications. When used as a shunt limiter, 1 dB compression occurs when Pin = ~25 dBm and small-signal insertion loss is less than 1 dB up to 6 GHz. The HMMC-5633 can also protect sensitive components from ESD damage. The degree of protection offered is dependent on the protected component’s characteristics. ESD damage level for the HMMC-5633 by itself is greater than 8 kv (measured with IEC801–2, 150 pF, 330 Ω ESD generator).

Biasing and Operation

The HMMC-5633 needs no bias.

Assembly Techniques

This package is compatible with wave-solder or reflow printed circuit board soldering processes.

GaAs MMICs in either chip or SMT packages are ESD sensitive. ESD preventive measures must be employed in all aspects of storage, handling, and assembly. MMIC ESD precautions, handling considerations, die attach and bonding methods are critical factors in successful GaAs MMIC performance and reliability.

Keysight application note #54, “GaAs MMIC ESD, Die Attach and Bonding.

Guidelines” provides basic information on these subjects.

Moisture Sensitivity Classification: Class 1, per JESD22-A112-A.

The TC623 die is fabricated using a GaAs-based diode semiconductor material structure which is compatible with newer RoHS assembly temperatures and allows the device to be attached to a hybrid microcircuit housing or to thermally conductive embedded heatsinks which exist in QFN SMT Packages.

Moisture Compatibility

Injection mold components like the HMMC-5633 in QFN are moisture-sensitive. The product is tested to the Moisture and Reflow Sensitivity Level 5A as per IPC/Jedec J-STD-020 and must be mounted within 24 hours of opening the shipping container. Store and handle parts for re-flow and for rework per IPC/Jedec J-STD-033B. An example of the moisture sensitivity label is shown in Figure 3.

Tape and Reel

The HMMC-5634 is available in tape and reel format to facilitate automatic pick and place manufacturing. See Figure 8.

RoHS Compliance

The HMMC-5633 prescaler is RoHS Compliant. This means the component meets the requirements of the European Parliament and the Council of the European Union “Restriction of Hazardous Substances” Directive 2002/95/EC, commonly known as “RoHS”. The six regulated substances are lead, mercury, cadmium, chromium VI (hexavalent), polybrominated biphenyls (PBB) and polybrominated biphenyl ethers (PBDE). RoHS compliance implies that any residual concentration of these substances is below the RoHS Directive’s maximum concentration values (MVC); being less than 1000 ppm by weight for all substances except for cadmium which is less than 100 ppm by weight.