Sarcina Delivers Right-First-Time Packages Using ADS for Chip-Package-Board Simulation
Case Studies
Right-first-time IC Package Design Solution
Semiconductor package engineering has a unique set of challenges that make it difficult for fabless semiconductor companies to win first-time success. Packages come in many different materials and topologies, suited for different applications such as medical, aerospace, automotive, consumer electronics, etc. Converging on an optimal package design for complex semiconductors such as CPU/GPU/NPU has evolved into a highly specialized practice.
Sarcina Technology LLC, headquartered in Palo Alto with a presence in Taipei, Taiwan, is one such semiconductor package design service. Established in 2011, Sarcina has carved a niche in designing semiconductor packages for some of the most sophisticated devices in the market. Their prowess is showcased in their work on workstations and datacenter CPUs, GPUs, and network processors that employ the latest technologies.