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Even with a well-simulated printed circuit board design, the signal integrity performance of the fabricated board hinges on the fabrication process. This presentation underscores the importance of considering as-fabricated material properties in your simulation. This presentation offers valuable PCB material properties and signal integrity insights for both new and seasoned hardware engineers and signal integrity engineers.
With a comprehensive exploration of parameters such as trace etch-back, trace thickness, and substrate height, the session also identifies the impact of cross-sectional geometry on signal integrity metrics. Emphasizing the theoretical understanding of the impact of material property and cross-sectional geometry, the presentation equips attendees with the knowledge of what to expect from simulation and measurement after fabrication.
The session concludes with a case study of a failed design, proposing corrective measures. By imparting practical insights, this session empowers engineers to design PCBs with real-world fabrication processes in mind. Join us for an engaging exploration of the intricate interplay between design simulation, material properties, and fabrication realities.
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