Lowering the Production Cost of MEMS Devices
应用文章
Introduction
Recently, various devices using MEMS technology such as pressure sensors, accelerometers, and RF MEMS have been commercialized. Additionally, new devices such as silicon microphones have been evolving rapidly. The MEMS market started with the automotive industry and has been expanding to consumer products such as cellular phones.
This MEMS market expansion also applies pressure on manufacturers to lower their costs per unit. However, few opportunities exist, mainly due to:
- Low yields due to the precision process
- Slow throughput due to applying the physical
A recent study (see item 1 in the Appendix) attributes 80% of the total production cost to the device packaging process, so defective chip inflow to the packaging process contributes to the cost rise. Therefore, we will discuss how to evaluate MEMS elements at the on-wafer stage in order to lower the total production cost
stimulus