Beam Lead Device Bonding to Soft Substrates
应用文章
Description
There are three methods that can be used for attaching beam lead devices to soft substrates. The method selected will depend on the substrate material, the plating applied to the conductors, equipment available, constraints on the use of conductive epoxys, and volume.
1. Epoxy
Epoxy should be considered if there is to be volume production and the use of this material is allowed. Equipment is available to dispense the epoxy and place the beam lead onto the epoxy fully automatically. (See Application Note AN-992 for more information.)
2. Reflow
If conditions allow, the conductor can be plated with bright tin (100 to 300 m inches) and the beam lead attached by reflowing the tin using a wire bonder with a solid tool used as a soldering tip. (See Application Note AN-992 for more information.)